Technospark plans to combine oTFT and IGZO TFT technologies in Russian Flexible Electronics Center

Technospark plans to combine oTFT and IGZO TFT technologies in Russian Flexible Electronics Center

Technospark plans to combine oTFT and IGZO TFT technologies in Russian Flexible Electronics CenterNanotechnology center Technospark (Moscow, Troitsk) announced the plans to combine two thin-film transistor technologies based on metal-oxide and organic materials in one low-volume pilot-line facility in Troitsk. Russian Flexible Electronics Centre (RFEC) aims to establish a platform for prototyping and small volume manufacturing of new products based on flexible thin-film transistor technologies. In partnership with leading European companies imec (Belgium), Holst Centre, set up by imec and TNO (The Netherlands), and FlexEnable (Great Britain), RFEC will develop a range of advanced thin-film transistor technologies based on metal-oxide and organic materials. RFEC will focus on the customized development of new flexible electronics components (like displays, sensors, NFC and RFID tags) for end-user companies, high-quality prototyping and small volume manufacturing. Due to the close cooperation with global industry leaders, RFEC has access to cutting-edge materials, equipment and processes. The established ecosystems of imec, Holst Centre and FlexEnable, including material and equipment suppliers as well as application and end-user companies are an efficient vehicle to evaluate the upscaling of new technologies to volume manufacturing.
“Producing small volumes of novel components and making them available to application companies for tests is a big step in accelerating the market introduction of new technologies. For a young industry like flexible electronics, the demonstration of first success cases is particularly important” – comments Paul Heremans, department director of thin-film electronics at imec and technology director at the Holst Centre.
Paul Cain, Strategy Director at FlexEnable shares this opinion: “An agile facility that can adapt to small runs of high quality arrays for a range of applications will be an important part of facilitating adoption of flexible electronics for new and existing markets, whilst enabling product companies and system integrators to understand how flexible electronics can transform their future products”.
Denis Kovalevich, General Director of TechnoSpark, says: “We are filling the gap in the flexible electronics supply chain, taking the prototyping niche between R&D and volume production. To ensure the seamless volume scaling between prototyping and volume manufacturing, the infrastructure at RFEC will be fully compatible with existing mass production facilities. The aim is to integrate it into the global supply chain”.